STUDY OF THE INFLUENCE OF VARIOUS PARAMETERS ON OBTAINING COPPER AND SILVER COATINGS IN DIELECTRIC MATERIALS BY PHOTOCHEMICAL METHOD
DOI:
https://doi.org/10.54251/2616-6429.2025.02.0008nuKeywords:
copper, silver, casings, dielectric materials, reducing agent, copper halidesAbstract
This article contains materials on the chemical coating of copper and silver. At present, metal and dielectric surfaces are coated with silver to provide anticorrosive, catalytic and bactericidal properties. Such coatings are used in the process of chemical synthesis, ecology, medicine and in the production of consumer products. The possibility of depositing photochemical methods of copper gallium on the surface of metallic and nonmetallic products is investigated. High photosensitive properties of copper gallides are determined. A method for producing composite coatings is proposed, in which initially a layer of non-metallic phase is created on the surface to be coated. For this, the product is wetted with a solution of copper sulfate, then a non-metallic phase is sprayed onto this layer. When the product is subsequently processed with phosphine, a primary metallic layer is formed, which fixes the non-metallic phase on the surface of the article. Further overgrowth by the metal phase (matrix) by galvanic or chemical means.